The most commonly used hot melt application technique is non-contact spraying under high pressure.
By simply activating a nozzle, a glue line is applied and the product, such as a packaging, can be closed inline. The hot melt system is under a high pressure of 10 to 30 bar and can therefore dose adhesive very precisely and quickly. In addition to packaging, this technique is used for all kinds of production processes, for bonding cardboard, plastics, metal, foam, glass, etc.